STW82102B datasheet(12/67 Pages) STMICROELECTRONICS

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Operating conditions

STW82102B

12/67

Doc ID 018516 Rev 2

Operating conditions

Table 4.

Operating conditions

Symbol

Parameter

Test conditions

Min

Typ

Max

Unit

AVCC1

Analog Supply voltage

3.15

3.3

3.45

AVCC2

Analog Supply voltage

4.75

5.25

DVCC

Digital Supply voltage

3.15

3.3

3.45

ICC3.3V

Current Consumption at 3.3 V

Standard mode

130

150

External VCO standard mode

110

130

Diversity slave mode

105

120

Diversity master mode

155

180

External VCO diversity master

mode

-140

160

ICC5V

Current Consumption

High current mode at 5 V

160

185

Low current mode at 3.3 V

110

Operating ambient temperature

-40

°C

Maximum junction temperature

125

°C

ΘJA

Junction to ambient package thermal

resistance(1)

Multi-layer JEDEC board

°C/W

ΘJB

Junction to board package thermal

resistance(1)

Multi-layer JEDEC board

°C/W

ΘJC

Junction to case package thermal

resistance(1)

Multi-layer JEDEC board

°C/W

ΨJB

Thermal characterization parameter

junction to board(1)

Multi-layer JEDEC board

°C/W

ΨJT

Thermal characterization parameter

junction to top case(1)

Multi-layer JEDEC board

0.3

°C/W

Refer to JEDEC standard JESD 51-12 for a detailed description of the thermal resistances and thermal parameters.

Data here presented are referring to a Multi-layer board according to JEDEC standard.

TJ = TA + ΘJA * Pdiss (in order to estimate TJ if ambient temperature TA and dissipated power Pdiss are known)

TJ = TB + ΨJB * Pdiss (in order to estimate TJ if board temperature TB and dissipated power Pdiss are known)

TJ = TT + ΨJT * Pdiss (in order to estimate TJ if top case temperature TT and dissipated power Pdiss are known)

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