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CXP-82224 Scheda tecnica(PDF) 21 Page - Sony Corporation |
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CXP-82224 Scheda tecnica(HTML) 21 Page - Sony Corporation |
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21 / 21 page ![]() – 21 – CXP82220/82224 Package Outline Unit: mm SONY CODE EIAJ CODE JEDEC CODE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY PACKAGE STRUCTURE 23.9 ± 0.4 QFP-100P-L01 100PIN QFP (PLASTIC) 20.0 – 0.1 + 0.4 0.15 – 0.05 + 0.1 2.75 – 0.15 + 0.35 A 0.65 M 0.13 QFP100-P-1420 1.7g 1 100 81 80 51 50 31 30 0.3 – 0.1 + 0.15 DETAIL A 0° to 10° 0.15 0.1 – 0.05 + 0.2 |
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