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RT7248 Scheda tecnica(PDF) 13 Page - Richtek Technology Corporation |
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RT7248 Scheda tecnica(HTML) 13 Page - Richtek Technology Corporation |
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13 / 15 page ![]() RT7248 13 DS7248-01 September 2012 www.richtek.com © Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. increasing the copper area of pad to 70mm2 (Figure 7.e) reduces the θJA to 49°C/W. The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. The Figure 8 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power dissipation allowed. Figure 8. Derating Curve of Maximum Power Dissipation 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 Ambient Temperature (°C) Copper Area 70mm 2 50mm 2 30mm 2 10mm 2 Min.Layout Four-Layer PCB (a) Copper Area = (2.3 x 2.3) mm2, θJA = 75°C/W (b) Copper Area = 10mm2, θJA = 64°C/W (c) Copper Area = 30mm 2 , θJA = 54°C/W (d) Copper Area = 50mm2 , θJA = 51°C/W (e) Copper Area = 70mm2 , θJA = 49°C/W Figure 7. Themal Resistance vs. Copper Area Layout Design |
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