RT8294 datasheet(13/15 Pages) RICHTEK

13 / 15 page

RT8294

DS8294-02

March 2011

www.richtek.com

2 ,

θJA = 54°C/W

(d) Copper Area = 50mm

2 ,

θJA = 51°C/W

Figure 6. Thermal Resistance vs. Copper Area Layout

Design

(e) Copper Area = 70mm

2 ,

θJA = 49°C/W

Layout Considerations

For best performance of the RT8294, the following layout

guidelines must be strictly followed.

}

Input capacitor must be placed as close to the IC as

possible.

}

SW should be connected to inductor by wide and short

trace. Keep sensitive components away from this trace.

}

The feedback components must be connected as close

to the device as possible

Figure 8. PCB Layout Guide

VIN

VOUT

GND

CIN

GND

VOUT

COUT

Input capacitor must be placed

as close to the IC as possible.

SW should be connected to inductor by

wide and short trace. Keep sensitive

components away from this trace.

The feedback components

must be connected as close

to the device as possible.

BOOT

VIN

GND

COMP

GND

CSS

RS CS

GND

VIN

REN

Table 3. Suggested Capacitors for CIN and COUT

Location

Component Supplier

Part No.

Capacitance (

μF)

Case Size

CIN

MURATA

GRM31CR61E106K

1206

CIN

TDK

C3225X5R1E106K

1206

CIN

TAIYO YUDEN

TMK316BJ106ML

1206

COUT

MURATA

GRM31CR60J476M

1206

COUT

TDK

C3225X5R0J476M

1210

COUT

MURATA

GRM32ER71C226M

1210

COUT

TDK

C3225X5R1C22M

1210

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