XC6227 datasheet(21/25 Pages) TOREX

Il numero della parte	XC6227

Spiegazioni elettronici	700mA High Speed LDO Regulator with Reverse Current Protection

PDF	25 Pages

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Produttore elettronici	TOREX [Torex Semiconductor]

Homepage	http://www.torex.co.jp

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XC6227

Series

●

USP-6C Power Dissipation

Board Mount (Tj max = 125℃)

Ambient Temperature（℃）

Power Dissipation Pd（mW）

Thermal Resistance (℃/W)

1000

400

100.00

て

Pd-Ta特性グラフ

200

400

600

800

1000

1200

105

125

周辺温度Ta（℃）

Power dissipation data for the USP-6C is shown in this page.

The value of power dissipation varies with the mount board conditions.

Please use this data as the reference data taken in the following condition.

Measurement Condition

Condition:

Mount on a board

Ambient:

Natural convection

Soldering:

Lead (Pb) free

Board:

Dimensions 40 x 40 mm (1600 mm

2 in one side)

Copper (Cu) traces occupy 50% of the board area

In top and back faces

Package heat-sink is tied to the copper traces

Material:

Glass Epoxy (FR-4)

Thickness:

1.6 mm

Through-hole: 4 x 0.8 Diameter

Evaluation Board (Unit: mm)

2. Power Dissipation vs. Ambient Temperature

Pd vs. Ta

Ambient Temperature: Ta (℃)

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PACKAGING INFORMATION (Continued)

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