AD20msp410

–7–

REV. 0

Mechanical Considerations

The chipset has been specifically designed to meet not only cost

and power consumption requirements but also attention was

paid to the physical dimensions. State-of-the-art package

technology was used to achieve smallest possible geometries. See

Table II for a list of main packaging dimensions and consult

individual data sheets of the three components for further

details.

Table II. Package Dimensions

Parameter

ASP

PLP

BBC

Unit

Package

TQFP

TQFP

TQFP

Leads

100

176

80

Pitch

0.5

0.5

0.65

mm

Body

14

× 14

24

× 24

14

× 14

mm

2

Total Height

1.6

1.7

1.6

mm

Board Area

16

× 16

26

× 26

16

× 16

mm

2

All three components utilize low profile Plastic Quad Flat Packs

with lead pitches of 0.5 mm minimum. Special attention was

paid to the possible use in PCMCIA cards.

ORDERING GUIDE

To order the parts for the AD20msp410 GSM chipset, please

order one of each of the following components.

Part

Part Number

Supply Voltage Range

ASP

ADSP-2178-780244

+2.7 V to 3.6 V

BBC

AD53/009-9 (Special AD7015) +2.7 V to 3.6 V

PLP

ADPLP01

+2.7 V to 3.6 V

An evaluation and development system may be ordered for this

chipset, under the part number, AD20msp410-EB03.