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AD5541 Scheda tecnica(PDF) 4 Page - Analog Devices |
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AD5541 Scheda tecnica(HTML) 4 Page - Analog Devices |
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4 / 12 page ![]() AD5541/AD5542 –4– REV. A CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD5541/AD5542 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE ABSOLUTE MAXIMUM RATINGS * (TA = 25°C unless otherwise noted) VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V Digital Input Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V VOUT to AGND . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V AGND, AGNDF, AGNDS to DGND . . . . . –0.3 V to +0.3 V Input Current to Any Pin Except Supplies . . . . . . . . ±10 mA Operating Temperature Range Industrial (A, B, C Versions) . . . . . . . . . . . –40 °C to +85°C Commercial (J, L Versions) . . . . . . . . . . . . . . . 0 °C to 70°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C ORDERING GUIDE Model INL DNL Temperature Range Package Description Package Option AD5541CR ±1 LSB ±1 LSB –40 °C to +85°C 8-Lead Small Outline IC SO-8 AD5541LR ±1 LSB ±1 LSB 0 °C to 70°C 8-Lead Small Outline IC SO-8 AD5541BR ±2 LSB ±1 LSB –40 °C to +85°C 8-Lead Small Outline IC SO-8 AD5541JR ±2 LSB ±1.5 LSB 0 °C to 70°C 8-Lead Small Outline IC SO-8 AD5541AR ±4 LSB ±1 LSB –40 °C to +85°C 8-Lead Small Outline IC SO-8 AD5542CR ±1 LSB ±1 LSB –40 °C to +85°C 14-Lead Small Outline IC R-14 AD5542LR ±1 LSB ±1 LSB 0 °C to 70°C 14-Lead Small Outline IC R-14 AD5542BR ±2 LSB ±1 LSB –40 °C to +85°C 14-Lead Small Outline IC R-14 AD5542JR ±2 LSB ±1.5 LSB 0 °C to 70°C 14-Lead Small Outline IC R-14 AD5542AR ±4 LSB ±1 LSB –40 °C to +85°C 14-Lead Small Outline IC R-14 Die Size = 80 × 139 = 11,120 sq mil; Number of Transistors = 1,230. Maximum Junction Temperature, (TJ max) . . . . . . . . . 150°C Package Power Dissipation . . . . . . . . . . . . . (TJ max – TA)/θJA Thermal Impedance θ JA SOIC (SO-8) . . . . . . . . . . . . . . . . . . . . . . . . . . 149.5 °C/W SOIC (R-14) . . . . . . . . . . . . . . . . . . . . . . . . . . 104.5 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 °C *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. |
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