HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : IC200401

Issued Date : 2004.02.01

Revised Date : 2005.07.14

Page No. : 7/8

H1117 Series

HSMC Product Specification

TO-220AB Dimension

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-5983621~5 Fax: 886-3-5982931

A

B

E

G

I

K

M

O

P

3

2

1

C

N

H

D

Tab

F

J

L

DIM

Min.

Max.

A

5.58

7.49

B

8.38

8.90

C

4.40

4.70

D

1.15

1.39

E

0.35

0.60

F

2.03

2.92

G

9.66

10.28

H

-

*16.25

I-

*3.83

J

3.00

4.00

K

0.75

0.95

L

2.54

3.42

M

1.14

1.40

N-

*2.54

O

12.70

14.27

P

14.48

15.87

*: Typical, Unit: mm

Marking:

Control Code

Date Code

HE

1117

Pb Free Mark

Pb-Free: "

Normal: None

Product Series

ADJ(A),1.8(B),2.5(C)

3.3(D),5(E)

Note: Green label is used for pb-free packing

Pin Style: 1.ADJ/GND 2(Tab).VOUT 3.VIN

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

3-Lead TO-220AB

Plastic Package

HSMC Package Code: E