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MTCH6301-I/ML Scheda tecnica(PDF) 21 Page - Microchip Technology

Il numero della parte MTCH6301-I/ML
Spiegazioni elettronici  The MTCH6301 is a turnkey projected capacitive con-troller that allows easy integration of multi-touch and gestures to create a rich user interface in your design.
PDF  32 Pages
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Produttore elettronici  MICROCHIP [Microchip Technology]
Homepage  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MTCH6301-I/ML Scheda tecnica(HTML) 21 Page - Microchip Technology

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 2012 Microchip Technology Inc.
DS41663A-page 21
MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
8.0
ELECTRICAL
CHARACTERISTICS
This section provides an overview of the MTCH6301
electrical characteristics.
8.1
Absolute Maximum Ratings
Absolute maximum ratings for the MTCH6301 device
are listed below. Exposure to these maximum rating
conditions for extended periods may affect device reli-
ability. Functional operation of the device at these or
any other conditions, above the parameters indicated
in the operation listings of this specification, is not
implied.
Ambient temperature under bias …………………………………………………..................….....……..............-40 to +85°C
Storage temperature……………………………………………………………….......................…...…….………-65 to 150°C
Voltage on VDD with respect to VSS……………………………....…………………….............................………-0.3V to 4.0V
Voltage on all other pins with respect to VSS………………………………………..…...............………-0.3V to (VDD + 0.3V)
Maximum current out of VSS pin …..……………………………………………………..........……………...............…300 mA
Maximum current into VDD pin(s) ……….………………………………………………………..........…………………300 mA
Maximum output current sunk by any I/O pin…………………………………………………..................………………15 mA
Maximum output current sourced by any I/O pin …………………………………………………...................…………15 mA
Maximum current sunk by all ports. …………………………………………………………………….............………. 200 mA
Maximum current sourced by all ports. ………………………………………………………………………................ 200 mA
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at those or any other conditions, above those indicated in the
operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
8.2
DC Characteristics
TABLE 8-1:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min.
Typ.
Max.
Units
Operating Junction Temperature Range
TJ
-40
+125
⁰C
Operating Ambient Temperature Range
TA
-40
+85
⁰C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD-Ʃ IOH)
I/O Pin Power Dissipation:
PI/O = Ʃ (({VDD - VOH} x IOH) + Ʃ (VOL x IOL))
PD
PINT + PI/O
W
Maximum Allows Power Dissipation
PDMAX
(TJ - TA) / θJA
W
TABLE 8-2:
THERMAL PACKAGING CHARACTERISTICS
Characteristics
Symbol
Typ.
Max.
Units
Package Thermal Resistance, 44-pin QFN
θJA
32
⁰C/W
Package Thermal Resistance, 44-pin TQFP
θJA
45
⁰C/W
TABLE 8-3:
OPERATING VOLTAGE AND CURRENT
Symbol
Characteristics
Min
Typ
Max
Units
VDD
Supply Voltage
2.4
3.6
V
IDD
Operating Current
20
30
mA
ISLP
Sleep Current
20
µA



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