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MTCH6301-I/ML Scheda tecnica(PDF) 21 Page - Microchip Technology |
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MTCH6301-I/ML Scheda tecnica(HTML) 21 Page - Microchip Technology |
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21 / 32 page ![]() 2012 Microchip Technology Inc. DS41663A-page 21 MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER 8.0 ELECTRICAL CHARACTERISTICS This section provides an overview of the MTCH6301 electrical characteristics. 8.1 Absolute Maximum Ratings Absolute maximum ratings for the MTCH6301 device are listed below. Exposure to these maximum rating conditions for extended periods may affect device reli- ability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied. Ambient temperature under bias …………………………………………………..................….....……..............-40 to +85°C Storage temperature……………………………………………………………….......................…...…….………-65 to 150°C Voltage on VDD with respect to VSS……………………………....…………………….............................………-0.3V to 4.0V Voltage on all other pins with respect to VSS………………………………………..…...............………-0.3V to (VDD + 0.3V) Maximum current out of VSS pin …..……………………………………………………..........……………...............…300 mA Maximum current into VDD pin(s) ……….………………………………………………………..........…………………300 mA Maximum output current sunk by any I/O pin…………………………………………………..................………………15 mA Maximum output current sourced by any I/O pin …………………………………………………...................…………15 mA Maximum current sunk by all ports. …………………………………………………………………….............………. 200 mA Maximum current sourced by all ports. ………………………………………………………………………................ 200 mA Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 8.2 DC Characteristics TABLE 8-1: THERMAL OPERATING CONDITIONS Rating Symbol Min. Typ. Max. Units Operating Junction Temperature Range TJ -40 — +125 ⁰C Operating Ambient Temperature Range TA -40 — +85 ⁰C Power Dissipation: Internal Chip Power Dissipation: PINT = VDD x (IDD-Ʃ IOH) I/O Pin Power Dissipation: PI/O = Ʃ (({VDD - VOH} x IOH) + Ʃ (VOL x IOL)) PD PINT + PI/O W Maximum Allows Power Dissipation PDMAX (TJ - TA) / θJA W TABLE 8-2: THERMAL PACKAGING CHARACTERISTICS Characteristics Symbol Typ. Max. Units Package Thermal Resistance, 44-pin QFN θJA 32 — ⁰C/W Package Thermal Resistance, 44-pin TQFP θJA 45 — ⁰C/W TABLE 8-3: OPERATING VOLTAGE AND CURRENT Symbol Characteristics Min Typ Max Units VDD Supply Voltage 2.4 — 3.6 V IDD Operating Current — 20 30 mA ISLP Sleep Current — 20 — µA |
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