AD795

REV. A

–16–

OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).

Plastic Mini-DIP (N) Package

0.011

±0.003

(0.28

±0.08)

0.30 (7.62)

REF

15

°

0

°

PIN 1

4

5

8

1

0.25

(6.35)

0.31

(7.87)

0.10

(2.54)

BSC

SEATING

PLANE

0.035

±0.01

(0.89

±0.25)

0.18

±0.03

(4.57

±0.76)

0.033

(0.84)

NOM

0.018

±0.003

(0.46

±0.08)

0.125

(3.18)

MIN

0.165

±0.01

(4.19

±0.25)

0.39 (9.91) MAX

8-Pin SOIC (R) Package

0.019 (0.48)

0.014 (0.36)

0.050

(1.27)

BSC

0.102 (2.59)

0.094 (2.39)

0.197 (5.01)

0.189 (4.80)

0.010 (0.25)

0.004 (0.10)

0.098 (0.2482)

0.075 (0.1905)

0.190 (4.82)

0.170 (4.32)

0.030 (0.76)

0.018 (0.46)

10

°

0

°

0.090

(2.29)

8

°

0

°

0.020 (0.051) x 45

°

CHAMF

1

8

5

4

PIN 1

0.157 (3.99)

0.150 (3.81)

0.244 (6.20)

0.228 (5.79)

0.150 (3.81)

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