TS7001 datasheet(19/20 Pages) TOUCHSTONE

19 / 20 page

TS7001

TS7001DS r1p0

Page 19

RTFDS

example, P1.0) to generate a serial clock and using

two other I/O ports (for example, P1.1 for DOUT and

P1.2 for DIN) to transfer data from/to the TS7001.

A TS7001 to PIC16C6x/PIC16C7x Microcontroller

Interface

As shown in Figure 20, the connection between the

TS7001 and the PIC16C6x/PIC16C7x is simple and

does not require any glue logic circuits. The

PIC16C6x

synchronous

serial

port

(SSP)

configured as an SPI master with its clock polarity bit

set to 1 by writing to the synchronous serial port

control register (SSPCON). In this example, I/O port

RA1 is being used to generate the TS7001

’s CS

signal.

Since

this

microcontroller

family

only

transfers eight bits of data during each serial transfer

operation, two consecutive read/write operations are

required. For additional information, please consult

the PIC16/PIC17 Microcontroller User Manual.

APPLICATIONS INFORMATION

Ground Plane Management and Layout

For best performance, printed circuit boards should

always be used and wire-wrap boards are not

recommended. Good PC board layout techniques

ensure that digital and analog signal lines are kept

separate from

each other, analog and digital

(especially clock) lines are not routed parallel to one

another, and high-speed digital lines are not routed

underneath the ADC package.

A contiguous analog ground plane should be routed

under the TS7001 to avoid digital noise coupling. A

single-point analog ground (star ground point)

should be created at the ADC’s GND and separate

from any digital logic ground. All analog grounds as

well a

s the ADC’s GND pin should be connected to

the star ground. No other digital system ground

should be made to this ground connection. For

lowest-noise operation, the ground return to the star

ground’s power supply should be low impedance

and as short as possible.

Even though the TS7001

’s exhibits excellent supply

rejection

shown

Typical

Operating

Characteristics,

always

considered

good

engineering practice to prevent high-frequency noise

on the TS7001

’s VDD power supply from affecting

the ADC’s high-speed comparator. Therefore, the

VDD supply pin should be bypassed to the star

ground with 0.1μF and 10μF capacitors in parallel

and

placed close to the ADC’s Pin 2 as was shown

in Figure 4. Component lead lengths should be very

short for optimal supply-noise rejection. If the power

supply is very noisy, an optional 10-

Ω resistor

inserted in series with the TS7001

’s VDD pin can be

used in conjunction with the bypass capacitors to

form a low-pass filter.

Evaluating the TS7001

’s Dynamic Performance

The recommended layout for the TS7001 is outlined

in the demo board manual for the TS7001. The

demo board kit includes a fully assembled/tested

demo board and documentation describing how to

evaluate the TS7001

’s dynamic performance using

Touchstone Semiconductor’s proprietary TSDA-VB

data acquisition/capture kit.

Figure 20: Interfacing the TS7001 to

PIC16C6x/PIC16C7x-type Microcontrollers.

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