MRF6VP3091NR1 MRF6VP3091NR5 MRF6VP3091NBR1 MRF6VP3091NBR5

19

RF Device Data

Freescale Semiconductor, Inc.

PRODUCT DOCUMENTATION, TOOLS AND SOFTWARE

Refer to the following documents, tools and software to aid your design process.

Application Notes

• AN1907: Solder Reflow Attach Method for High Power RF Devices in Over--Molded Plastic Packages

• AN1955: Thermal Measurement Methodology of RF Power Amplifiers

• AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages

• AN3789: Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages

Engineering Bulletins

• EB212: Using Data Sheet Impedances for RF LDMOS Devices

Software

• Electromigration MTTF Calculator

• RF High Power Model

• .s2p File

For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the

Software & Tools tab on the part’s Product Summary page to download the respective tool.

REVISION HISTORY

The following table summarizes revisions to this document.

Revision

Date

Description

0

Sept. 2011

• Initial Release of Data Sheet

1

Dec. 2011

• Added R5 part numbers MRF6VP3091NR5 and MRF6VP3091NBR5, p. 1

• Fig. 7, CW Power Gain versus Output Power (Single--Ended Narrowband Test Circuit): adjusted x--axis

scale from 0 to 140 watts to 10 to 150 watts, p. 5

• Fig. 10, Intermodulation Distortion Products versus Two--Tone Spacing: added f = 860 MHz to graph

callouts, p. 6

• Added Fig. 21, 470--860 MHz Broadband 2″× 3.6″ Compact Reference Circuit Component Layout --

470--860 MHz -- Bottom, p. 10

• Added Fig. 22, 470--860 MHz Broadband 2″× 3.6″ Compact Reference Circuit Component Layout --

470--860 MHz -- Heatsink, p. 10