ADG620 datasheet(4/8 Pages) AD

4 / 8 page

REV. 0

ADG619/ADG620

–4–

ABSOLUTE MAXIMUM RATINGS

(TA = 25

°C unless otherwise noted)

VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V

VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V

Analog Inputs

2 . . . . . . . . . . . . . . . . V

SS –0.3 V to VDD +0.3 V

Digital Inputs

2 . . . . . . . . . . . . . . . . . –0.3 V to V

DD +0.3 V or

30 mA, Whichever Occurs First

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

(Pulsed at 1 ms, 10% Duty Cycle max)

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 50 mA

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . .

–40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

Micro-SOIC Package

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . 206

°C/W

JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44

°C/W

SOT-23 Package

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . 229.6

°C/W

JC Thermal Impedance . . . . . . . . . . . . . . . . . .

91.99

°C/W

Lead Temperature, Soldering (10 seconds) . . . . . . . . . 300

°C

IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . 220

°C

NOTES

1Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be

limited to the maximum ratings given.

ORDERING GUIDE

Branding

Model

Temperature Range

Information*

Package Description

Package Option

ADG619BRM

–40

°C to +85°C

SVB

Micro-SOIC (microSmall Outline IC)

RM-8

ADG619BRT

–40

°C to +85°C

SVB

SOT-23 (Plastic Surface Mount)

RT-8

ADG620BRM

–40

°C to +85°C

SWB

Micro-SOIC (microSmall Outline IC)

RM-8

ADG620BRT

–40

°C to +85°C

SWB

SOT-23 (Plastic Surface Mount)

RT-8

*Branding on SOT-23 and Micro-SOIC packages is limited to three characters due to space constraints.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the ADG619/ADG620 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions

are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

PIN CONFIGURATIONS

8-Lead SOT-23

(RT-8)

TOP VIEW

(Not to Scale)

NC = NO CONNECT

VDD

GND

VSS

ADG619/

ADG620

8-Lead Micro-SOIC

(RM-8)

TOP VIEW

(Not to Scale)

NC = NO CONNECT

VDD

GND

VSS

ADG619/

ADG620

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