ADG721/ADG722/ADG723

–4–

REV. 0

ORDERING GUIDE

Model

Temperature Range

Brand*

Package Description

Package Option

ADG721BRM

–40

°C to +85°C

S6B

µSOIC

RM-8

ADG722BRM

–40

°C to +85°C

S7B

µSOIC

RM-8

ADG723BRM

–40

°C to +85°C

S8B

µSOIC

RM-8

*Brand = Due to package size limitations, these three characters represent the part number.

PIN CONFIGURATION

8-Lead

SOIC (RM-8)

TOP VIEW

(Not to Scale)

8

7

6

5

1

2

3

4

S1

D1

IN2

GND

IN1

D2

S2

ADG721/

722/723

Table I. Truth Table (ADG721/ADG722)

ADG721 In

ADG722 In

Switch Condition

0

1

OFF

10

ON

Table II. Truth Table (ADG723)

Logic

Switch 1

Switch 2

0

OFF

ON

1

ON

OFF

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the ADG721/ADG722/ADG723 features proprietary ESD protection circuitry, per-

manent damage may occur on devices subjected to high energy electrostatic discharges. There-

fore, proper ESD precautions are recommended to avoid performance degradation or loss of

functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

1

°C unless otherwise noted)

Analog, Digital Inputs

2

30 mA, Whichever Occurs First

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

µSOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW

θ

°C/W

θ

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational sections

of this specification is not implied. Exposure to absolute maximum rating condi-

tions for extended periods may affect device reliability. Only one absolute maxi-

mum rating may be applied at any one time.

limited to the maximum ratings given.

TERMINOLOGY

Most Positive Power Supply Potential.

GND

Ground (0 V) Reference.

S

Source Terminal. May be an input or output.

D

Drain Terminal. May be an input or output.

IN

Logic Control Input.

Ohmic resistance between D and S.

∆R

ON

On resistance match between any two channels

Flatness is defined as the difference between the

maximum and minimum value of on resistance as

measured over the specified analog signal range.

Source leakage current with the switch “OFF.”

Drain leakage current with the switch “OFF.”

Channel leakage current with the switch “ON.”

Analog voltage on terminals D, S.

“OFF” Switch Source Capacitance.

“OFF” Switch Drain Capacitance.

Delay between applying the digital control input

and the output switching on.

Delay between applying the digital control input

and the output switching off.

“OFF” time or “ON” time measured between the

90% points of both switches, When switching

from one address state to another. (ADG723 Only)

Crosstalk

A measure of unwanted signal which is coupled

through from one channel to another as a result

of parasitic capacitance.

Off Isolation A measure of unwanted signal coupling through

an “OFF” switch.

Charge

A measure of the glitch impulse transferred

Injection

during switching.