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SSM2164P Scheda tecnica(PDF) 3 Page - Analog Devices |
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SSM2164P Scheda tecnica(HTML) 3 Page - Analog Devices |
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3 / 12 page ![]() SSM2164 REV. 0 –3– ORDERING GUIDE Temperature Package Package Model Range Description Options SSM2164P –40 °C to +85°C Plastic DIP N-16 SSM2164S –40 °C to +85°C Narrow SOIC R-16A ABSOLUTE MAXIMUM RATINGS Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Input, Output, Control Voltages . . . . . . . . . . . . . . . . V– to V+ Output Short Circuit Duration to GND . . . . . . . . . Indefinite Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Operating Temperature Range . . . . . . . . . . . . . –40 °C to +85°C Junction Temperature Range . . . . . . . . . . . . –65 °C to +150°C Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300 °C Package Type θ JA* θ JC Units 16-Pin Plastic DIP (P Suffix) 76 33 °C/W 16-Pin SOIC (S Suffix) 92 27 °C/W * θ JA is specified for the worst case conditions; i.e., θJA is specified for device in socket for P-DIP packages, θ JA is specified for device soldered in circuit board for SOIC package. PIN CONFIGURATION 16-Lead Epoxy DIP and SOIC MODE I IN1 V+ I IN4 I OUT2 V C2 I IN2 I OUT3 V C3 I IN3 V C1 I OUT1 V C4 I OUT4 GND V– 1 2 16 15 5 6 7 12 11 10 3 4 14 13 89 TOP VIEW (Not to Scale) SSM2164 WARNING! ESD SENSITIVE DEVICE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the SSM2164 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
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