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TMP01FS Scheda tecnica(PDF) 16 Page - Analog Devices |
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TMP01FS Scheda tecnica(HTML) 16 Page - Analog Devices |
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16 / 16 page ![]() TMP01 REV. C –16– OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 8-Pin Epoxy DIP 0.160 (4.06) 0.115 (2.93) 0.130 (3.30) MIN 0.210 (5.33) MAX 0.015 (0.381) TYP 0.430 (10.92) 0.348 (8.84) 0.280 (7.11) 0.240 (6.10) 4 5 8 1 0.070 (1.77) 0.045 (1.15) 0.022 (0.558) 0.014 (0.356) 0.325 (8.25) 0.300 (7.62) 0 °- 15° 0.100 (2.54) BSC 0.015 (0.381) 0.008 (0.204) SEATING PLANE 0.195 (4.95) 0.115 (2.93) 8-Pin SOIC SEATING PLANE 0.0500 (1.27) BSC 4 5 8 1 0.2440 (6.20) 0.2284 (5.80) 0.1574 (4.00) 0.1497 (3.80) 0.1968 (5.00) 0.1890 (4.80) 0.0500 (1.27) 0.0160 (0.41) 0 °-8° × 45° 0.0196 (0.50) 0.0099 (0.25) 0.0098 (0.25) 0.0075 (0.19) 0.102 (2.59) 0.094 (2.39) 0.0192 (0.49) 0.0138 (0.35) 0.0098 (0.25) 0.0040 (0.10) 8-Pin TO-99 45 ° BSC 0.115 (2.92) BSC 0.034 (0.86) 0.027 (0.69) 0.045 (1.14) 0.027 (0.69) 0.160 (4.06) 0.110 (2.79) 0.115 (2.92) BSC 0.230 (5.84) BSC 6 8 5 7 1 4 2 3 REFERENCE PLANE BASE & SEATING PLANE 0.335 (8.51) 0.305 (7.75) 0.370 (9.40) 0.335 (8.51) 0.750 (19.05) 0.500 (12.70) 0.045 (1.14) 0.010 (0.25) 0.050 (1.27) MAX 0.040 (1.02) MAX 0.019 (0.48) 0.016 (0.41) 0.021 (0.53) 0.016 (0.41) 0.185 (4.70) 0.165 (4.19) 0.250 (6.35) MIN |
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