TS3003

Touchstone Semiconductor, Inc.

Page 10

630 Alder Drive, Milpitas, CA 95035

TS3003DS r1p0

+1 (408) 215 - 1220

RTFDS

PACKAGE OUTLINE DRAWING

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assume any responsibility for its use nor for any infringements of patents or other rights of third parties that may result from its use, and all

information provided by Touchstone Semiconductor and its suppliers is provided on an AS IS basis, WITHOUT WARRANTY OF ANY KIND.

Touchstone Semiconductor reserves the right to change product specifications and product descriptions at any time without any advance

notice. No license is granted by implication or otherwise under any patent or patent rights of Touchstone Semiconductor. Touchstone

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applications using Touchstone Semiconductor components. To minimize the risk associated with customer products and applications,

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respective owners.

BOTTOM VIEW

3.00±0.05

3.00±0.05

TOP VIEW

Pin 1 DOT BY

MARKING

NOTE!

 All dimensions in mm.

 Compliant with JEDEC MO-229

SIDE VIEW

0.25±0.05

0.50 BSC

2.30±0.10

1.60±0.10

CO.35

Dap Size

2.65X1.90 mm

0.40±0.05

0.30Ref

0.75±0.05

0.00±0.05

10-Pin TDFN33 Package Outline Drawing

(N.B., Drawings are not to scale)