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STM32F103CBT6 Scheda tecnica(PDF) 89 Page - STMicroelectronics |
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STM32F103CBT6 Scheda tecnica(HTML) 89 Page - STMicroelectronics |
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89 / 102 page ![]() STM32F103x8, STM32F103xB Package characteristics Doc ID 13587 Rev 14 89/102 Figure 53. Recommended PCB design rules for pads (0.5 mm pitch BGA) 1. Non solder mask defined (NSMD) pads are recommended 2. 4 to 6 mils solder paste screen printing process Pitch 0.5 mm D pad 0.27 mm Dsm 0.35 mm typ (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter Dpad Dsm ai15495 |
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