HCC4xxx

Package mechanical data

Doc ID 17102 Rev 3

13/24

Figure 5.

Ceramic DIL-16 package drawings

Note:

The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the

package. Connecting unused pins or metal lid to ground or to the power supply will not affect

the electrical characteristics.

Table 7.

Ceramic DIL-16 package dimensions

Dim

mm

Min

Typ

Max

A

2.10

2.71

a1

3.00

3.70

a2

0.63

0.88

1.14

B

1.82

2.39

b

0.40

0.45

0.50

b1

0.20

0.254

0.30

D

20.06

20.32

20.58

E

7.36

7.62

7.87

e

2.54

e1

17.65

17.78

17.90

e2

7.62

7.87

8.12

F

7.29

7.49

7.70

I

3.83

K

10.90

12.10

L

1.14

1.50