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LMBR240FT1G Scheda tecnica(PDF) 5 Page - Leshan Radio Company |
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LMBR240FT1G Scheda tecnica(HTML) 5 Page - Leshan Radio Company |
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5 / 7 page ![]() Reel packing 5.Suggested thermal profile for soldering process 1. Storage environment:Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering LMBR220FT1G thru LMBR2200FT1G SOD123-FL 7" 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 8.7 REEL DIA. (mm) CARTON SIZE (mm) CARTON (PCS) PACKAGE REEL SIZE REEL (PCS) APPOX. GROSS WEIGHT (kg) COMPONENT SPACING (mm) BOX (pcs) INNER BOX (mm) Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3℃/sec Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(min to max)(ts) 150℃ 200℃ 60~120sec Tsmax to TL - Ramp-up Rate <3sec Time maintained above: - Temperature (TL) - Time(tL) 217℃ 60-260sec Peak Temperature(TP) 255 -0/+5℃ Time within 5℃ of actual Peak Temperature(TP) 10~30sec Ramp-down Rate <6℃/sec Time 25℃ to Peak Temperature <6minutes |
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