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MCP6482-E/MS Scheda tecnica(PDF) 45 Page - Microchip Technology |
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MCP6482-E/MS Scheda tecnica(HTML) 45 Page - Microchip Technology |
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45 / 50 page ![]() 2012-2013 Microchip Technology Inc. DS20002322C-page 45 MCP6481/2/4 APPENDIX A: REVISION HISTORY Revision C (June 2013) The following is the list of modifications: 1. Added new devices to the family (MCP6482 and MCP6484) and related information throughout the document. 2. Updated thermal package resistance information in Table 1-3. 3. Added Figure 2-35 in Section 2.0, Typical Per- formance Curves. 4. Updated Section 3.0, Pin Descriptions. 5. Added new Section 4.5, Unused Op Amps. 6. Updated the list of reference documents in Section 5.5, Application Notes. 7. Added package markings and drawings for the MCP6482 and MCP6484 devices. 8. Updated Product Identification System. Revision B (October 2012) The following is the list of modifications: 1. Updated the maximum low input offset voltage value in the Section “Features”. 2. Updated the minimum and maximum input offset voltage in Table 1-1 “DC Electrical Specifications”. 3. Replaced FIGURE 2-1: “Input Offset Voltage.” Revision A (September 2012) • Original Release of this Document. |
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