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AD8613AKSZ-R2 Scheda tecnica(PDF) 14 Page - Analog Devices |
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AD8613AKSZ-R2 Scheda tecnica(HTML) 14 Page - Analog Devices |
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14 / 16 page ![]() AD8613/AD8617/AD8619 Rev. E | Page 14 of 16 *COMPLIANT TO JEDEC STANDARDS MO-193-AB WITH THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS. 1.60 BSC 2.80 BSC 1.90 BSC 0.95 BSC 0.20 0.08 0.60 0.45 0.30 8° 4° 0° 0.50 0.30 0.10 MAX *1.00 MAX *0.90 MAX 0.70 MIN 2.90 BSC 54 12 3 SEATING PLANE Figure 43. 5-Lead Thin Small Outline Transistor Package [TSOT-23] (UJ-5) Dimensions shown in millimeters 1 EXPOSED PAD BOTTOM VIEW 0.50 BSC PIN 1 INDICATOR 0.50 0.40 0.30 TOP VIEW 12° MAX 0.70 MAX 0.65 TYP 0.90 MAX 0.85 NOM 0.05 MAX 0.01 NOM 0.20 REF 2.23 2.13 2.03 4 1.60 1.50 1.40 3.25 3.00 SQ 2.75 2.95 2.75 SQ 2.55 5 8 PIN 1 INDICATOR SEATING PLANE 0.30 0.23 0.18 0.60 MAX 0.60 MAX FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. Figure 44. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD] 3 mm × 3 mm Body, Very Thin, Dual Lead (CP-8-9) Dimensions shown in millimeters |
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