Motore di ricerca datesheet componenti elettronici
  Italian  ▼
ALLDATASHEETIT.COM

X  

AD8657ARMZ-R7 Scheda tecnica(PDF) 6 Page - Analog Devices

Il numero della parte AD8657ARMZ-R7
Spiegazioni elettronici  18 V, Precision, Micropower CMOS RRIO Operational Amplifier
PDF  24 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Produttore elettronici  AD [Analog Devices]
Homepage  http://www.analog.com
Logo AD - Analog Devices

AD8657ARMZ-R7 Scheda tecnica(HTML) 6 Page - Analog Devices

Back Button AD8657ARMZ-R7 Datasheet HTML 2Page - Analog Devices AD8657ARMZ-R7 Datasheet HTML 3Page - Analog Devices AD8657ARMZ-R7 Datasheet HTML 4Page - Analog Devices AD8657ARMZ-R7 Datasheet HTML 5Page - Analog Devices AD8657ARMZ-R7 Datasheet HTML 6Page - Analog Devices AD8657ARMZ-R7 Datasheet HTML 7Page - Analog Devices AD8657ARMZ-R7 Datasheet HTML 8Page - Analog Devices AD8657ARMZ-R7 Datasheet HTML 9Page - Analog Devices AD8657ARMZ-R7 Datasheet HTML 10Page - Analog Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 6 / 24 page
background image
AD8657
Rev. A | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
Supply Voltage
20.5 V
Input Voltage
(V−) − 300 mV to (V+) + 300 mV
Input Current1
±10 mA
Differential Input Voltage
±VSY
Output Short-Circuit
Duration to GND
Indefinite
Temperature Range
Storage
−65°C to +150°C
Operating
−40°C to +125°C
Junction
−65°C to +150°C
Lead Temperature
(Soldering, 60 sec)
300°C
1
The input pins have clamp diodes to the power supply pins. Limit the input
current to 10 mA or less whenever input signals exceed the power supply
rail by 0.3 V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages using a
standard 4-layer JEDEC board. The exposed pad is soldered to
the board.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
8-Lead MSOP (RM-8)
142
45
°C/W
8-Lead LFCSP (CP-8-11)
75
12
°C/W
ESD CAUTION



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24


Scheda tecnica Scarica

Go To PDF Page


Link URL



Lei ha avuto il aiuto da alldatasheet?  [ DONATE ] 

Di alldatasheet   |   Richest di pubblicita   |   contatti   |   Privacy Policy   |   Collegamento alla scheda tecnica    |   scambio Link   |   Ricerca produttore
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com