AD9789BBCZ datasheet(8/76 Pages) AD

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AD9789

Rev. A | Page 8 of 76

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

AVDD33 to AVSS

−0.3 V to +3.6 V

DVDD18 to DVSS

−0.3 V to +1.98 V

DVDD33 to DVSS

−0.3 V to +3.6 V

DVDD15 to DVSS

−0.3 V to +1.98 V

CVDD18 to AVSS

−0.3 V to +1.98 V

AVSS to DVSS

−0.3 V to +0.3 V

CLKP, CLKN to AVSS

−0.3 V to CVDD18 + 0.3 V

FS, DCO to DVSS

−0.3 V to DVDD33 + 0.3 V

CMOS and LVDS Data Inputs

to DVSS

−0.3 V to DVDD33 + 0.3 V

IOUTN, IOUTP to AVSS

−1.0 V to AVDD33 + 0.3 V

I120, VREF, IPTAT to AVSS

−0.3 V to AVDD33 + 0.3 V

IRQ, CS, SCLK, SDO, SDIO, RESET

to DVSS

−0.3 V to DVDD33 + 0.3 V

Junction Temperature

150°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 5. Thermal Resistance

Package

Type

θJA

θJB

θJC

Unit

Notes

25.5

14.4

6.8

°C/W

4-layer board, no vias

24.4

°C/W

4-layer board, 4 PCB vias

19.0

°C/W

8-layer board, 4 PCB vias

164-Ball

CSP_BGA

17.2

°C/W

8-layer board, 16 PCB vias

ESD CAUTION

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