SMM4F13A datasheet(5/10 Pages) STMICROELECTRONICS

5 / 10 page

SMM4F

Characteristics

5/10

Figure 9.

Leakage current versus junction temperature (typical values)

Figure 5.

Junction capacitance versus

reverse applied voltage (typical

values)

Figure 6.

Peak forward voltage drop versus

peak forward current (typical

values)

100

1000

10000

100

F=1 MHz

OSC=30 mVRMS

j=25 °C

SMM4F5.0A

SMM4F15A

SMM4F24A

SMM4F33A

C(pF)

V (V)

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

0.0

0.5

1.0

1.5

2.0

2.5

3.0

j =25 °C

j =125 °C

(A)

(V)

Figure 7.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (printed

ciruit board FR4, SCu = 1 cm

Figure 8.

Thermal resistance junction to

ambient versus copper surface

under each lead (printed circuit

board FR4, eCu = 35 µm)

0.00

0.01

0.10

1.00

1.0E-03

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

1.0E+03

On recommended pad

layout

Zth(j-a)/Rth(j-a)

t (S)

100

120

140

160

180

200

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

Rth(j-a)(°C/W)

(cm )

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

100

125

150

175

R=VRM

BR≤11.7V

BR>11.7V

T (°C)

I (nA)

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