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LM358 Scheda tecnica(PDF) 5 Page - First Components International |
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LM358 Scheda tecnica(HTML) 5 Page - First Components International |
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5 / 5 page ![]() 5 CHIP DIAGRAM Pad size 0.11 x 0.11 mm (Pad size is given as per passivation layer) Thickness of chip 0.35 ± 0.02 mm PAD LOCATION Pad No Symbol X Y 01 OUT1 0.087 0.085 02 IN1(-) 0.267 0.085 03 IN1(+0 0.852 0.085 04 GND 1.003 0.695 05 IN2(+) 0.852 1.305 06 IN2(-) 0.267 1.305 07 OUT2 0.087 1.305 08 VCC 0.087 0.695 08 07 1.21 0.03 ± 06 05 04 03 (0,0) 02 Chip marking 15T57 (x=1.028, y=1.374) LM358 Low Power Dual Operational Amplifier |
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