Product Details

DIMENSION A

DIMENSION B

DIMENSION C

DIMENSION D

INTERFACE MATERIAL

FINISH

Notes:

Dimensions are measureD in millimeters

Dimensions a & B refer to component size

Dimension c = the height of the heat sink shown aBove anD Does not

incluDe the height of the attachment methoD

ats reserves the right to upDate or change it proDucts without

notice

contact ats to learn aBout custom options availaBle

1)

2)

3)

4)

5)

thermal Performance

For more information, to find a distributor or to place an order, visit www.qats.com or

call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).

ATS PART # ATS-53230B-C1-R0

Features & Benefits

High Performance BGA Cooling

Solutions with maxiGRIP™ Attachment

REV1_0908

AIR VELOCITy

THERMAL RESISTANCE

ft/min

m/s

°c/w (unDucteD flow)

°c/w (DucteD flow)

200

1.0

300

1.5

400

2.0

500

2.5

600

3.0

700

3.5

800

4.0

16.8

12.4

10.5

9.3

8.5

7.8

7.3

7.6

23 mm

23 mm

7.5 mm

23 mm

Blue anoDizeD

chomerics t766

high aspect ratio, straight fin heat sinks that are ideal for compact pcB

environments

maxigrip™ attachment applies steady, even pressure to the

component and does not require holes in the pcB

Designed specifically for Bgas and other surface mount packages

meets telcordia gr-63-core office vibration, etsi 300 019

transportation vibration, and mil-stD-810 shock testing and

unpackaged Drop testing standards

comes preassembled with high performance, phase change, thermal

interface material

“keep-out” requirements: an “un-populated” boarder zone of 5

mm around the component is necessary to facilitate the installation/

removal of the maxigrip™. please refer to the maxigrip™ keep-

out guidelines and maxigrip™ installation/removal instructions for

further details

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*Image above is for illustration purposes only.