ADS4449 datasheet(3/54 Pages) TI

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ADS4449

www.ti.com

SBAS603 – APRIL 2013

THERMAL INFORMATION

ADS4449

THERMAL METRIC(1)

ZCR (BGA)

UNITS

144 PINS

θJA

Junction-to-ambient thermal resistance

35.9

θJCtop

Junction-to-case (top) thermal resistance

5.1

θJB

Junction-to-board thermal resistance

12.6

°C/W

ψJT

Junction-to-top characterization parameter

0.1

ψJB

Junction-to-board characterization parameter

12.4

θJCbot

Junction-to-case (bottom) thermal resistance

N/A

SPACER

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

SUPPLIES

AVDD33

3.15

3.3

3.45

AVDD

Supply voltage

1.8

1.9

2.0

DRVDD

1.7

1.8

2.0

ANALOG INPUTS

Differential input voltage range

VPP

Input common-mode voltage

VCM ± 0.025

Analog input common-mode current (per input pin of each channel)

1.5

µA/MSPS

VCM current capability

2-VPP input amplitude

(1)

400

MHz

Maximum analog input frequency

1.4-VPP input amplitude

500

MHz

CLOCK INPUTS

Input clock sample rate

184

250

MSPS

Sine wave, ac-coupled

0.2

1.5

VPP

LVPECL, ac-coupled

1.6

VPP

Input clock amplitude differential

(VCLKP – VCLKM)

LVDS, ac-coupled

0.7

VPP

LVCMOS, single-ended, ac-coupled

1.8

VPP

Input clock duty cycle

40%

50%

60%

DIGITAL OUTPUTS

Maximum external load capacitance from each output pin to DRVSS

CLOAD

3.3

(default strength)

RLOAD

Differential load resistance between the LVDS output pairs (LVDS mode)

100

TEMPERATURE RANGE

Operating free-air temperature

–40

+85

°C

Recommended

+105

°C

Operating junction temperature

Maximum rated(2)

+125

°C

(1)

See the Theory of Operation section.

(2)

Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate.

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