ADP1715ARMZ-3.0-R7 datasheet(15/20 Pages) AD

15 / 20 page

ADP1715/ADP1716

Rev. 0 | Page 15 of 20

140

VIN – VOUT (V)

120

100

1mA

10mA

50mA

100mA

250mA

360mA

500mA

(LOAD CURRENT)

DO NOT OPERATE ABOVE THIS POINT

MAX TJ

Figure 43. 300 mm2 of PCB Copper, TA = 85°C

140

VIN – VOUT (V)

120

100

1mA

10mA

50mA

100mA

250mA

360mA

500mA

(LOAD CURRENT)

DO NOT OPERATE ABOVE THIS POINT

MAX TJ

Figure 44. 100 mm2 of PCB Copper, TA = 85°C

140

VIN – VOUT (V)

120

100

1mA

10mA

50mA

100mA

250mA

360mA

500mA

(LOAD CURRENT)

DO NOT OPERATE ABOVE THIS POINT

MAX TJ

Figure 45. 0 mm2 of PCB Copper, TA = 85°C

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

The 8-lead MSOP package has the four GND pins fused together

internally, which enhances its thermal characteristics. Heat

dissipation from the package is increased by connecting as much

copper as possible to the four GND pins of the ADP1715/

ADP1716. From Table 5 it can be seen that a point of

diminishing returns eventually is reached, beyond which an

increase in the copper size does not yield additional heat

dissipation benefits.

Figure 46 shows a typical layout for the ADP1715/ADP1716.

The four GND pins are connected to a large copper pad. If a

second layer is available, multiple vias can be used to connect

them, increasing the overall copper area. The input capacitor

should be placed as close as possible to the IN and GND pins.

The output capacitor should be placed as close as possible to the

OUT and GND pins. 0603 or 0402 size capacitors and resistors

should be used to achieve the smallest possible footprint

solution on boards where area is limited.

GND (TOP)

GND (BOTTOM)

OUT

ADP1715/

ADP1716

Figure 46. Example PCB Layout

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