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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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MCR03EZPFX1002 Scheda tecnica(PDF) 34 Page - International Rectifier |
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MCR03EZPFX1002 Scheda tecnica(HTML) 34 Page - International Rectifier |
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34 / 36 page  34 IR3837MPbF Rev 1.31 Solder Resist It is recommended that the lead lands are Non Solder Mask Defined (NSMD). The solder resist should be pulled away from the metal lead lands by a minimum of 0.025mm to ensure NSMD pads. The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto the copper of 0.05mm to accommodate solder resist mis-alignment. Ensure that the solder resist in between the lead lands and the pad land is ≥ 0.15mm due to the high aspect ratio of the solder resist strip separating the lead lands from the pad land. |
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