PIC12C508/509

DS80023C-page 4

 2003 Microchip Technology Inc.

2.

Module: Packaging

The package information contained in the data sheet is

incorrect. Please refer to the following tables for correct

package data.

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

B1

B

A1

A

L

A2

p

α

E

eB

β

c

E1

n

D

1

2

Units

INCHES*

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

MIN

NOM

MAX

Number of Pins

n

88

Pitch

p

.100

2.54

Top to Seating Plane

A

.140

.155

.170

3.56

3.94

4.32

Molded Package Thickness

A2

.115

.130

.145

2.92

3.30

3.68

Base to Seating Plane

A1

.015

0.38

Shoulder to Shoulder Width

E

.300

.313

.325

7.62

7.94

8.26

Molded Package Width

E1

.240

.250

.260

6.10

6.35

6.60

Overall Length

D

.360

.373

.385

9.14

9.46

9.78

Tip to Seating Plane

L

.125

.130

.135

3.18

3.30

3.43

Lead Thickness

c

.008

.012

.015

0.20

0.29

0.38

Upper Lead Width

B1

.045

.058

.070

1.14

1.46

1.78

Lower Lead Width

B

.014

.018

.022

0.36

0.46

0.56

Overall Row Spacing

§

eB

.310

.370

.430

7.87

9.40

10.92

Mold Draft Angle Top

α

5

10

15

5

10

15

Mold Draft Angle Bottom

β

5

10

15

5

10

15

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

JEDEC Equivalent: MS-001

Drawing No. C04-018

.010” (0.254mm) per side.

§ Significant Characteristic