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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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TDA8950J Scheda tecnica(PDF) 19 Page - NXP Semiconductors |
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TDA8950J Scheda tecnica(HTML) 19 Page - NXP Semiconductors |
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19 / 39 page  TDA8950_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 11 June 2009 19 of 39 NXP Semiconductors TDA8950 2 × 150 W class-D power amplifier 13.5 Heatsink requirements An external heatsink must be connected to the TDA8950. Equation 5 defines the relationship between maximum power dissipation before activation of TFB and total thermal resistance from junction to ambient. (5) Power dissipation (P) is determined by the efficiency of the TDA8950. Efficiency measured as a function of output power is given in Figure 20. Power dissipation can be derived as a function of output power as shown in Figure 19. (1) Rth(j-a) = 5 K/W. (2) Rth(j-a) = 10 K/W. (3) Rth(j-a) = 15 K/W. (4) Rth(j-a) = 20 K/W. (5) Rth(j-a) = 35 K/W. Fig 9. Derating curves for power dissipation as a function of maximum ambient temperature R th ja – () T j T amb – P ------------------------ = P (W) 30 20 10 0 Tamb (°C) (1) (2) (3) (4) (5) 0 20 100 40 60 80 mbl469 |
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