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MCP25020I/P Scheda tecnica(PDF) 51 Page - Microchip Technology |
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MCP25020I/P Scheda tecnica(HTML) 51 Page - Microchip Technology |
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51 / 66 page ![]() © 2007 Microchip Technology Inc. DS21664D-page 51 MCP2502X/5X 9.0 ELECTRICAL CHARACTERISTICS 9.1 Absolute Maximum Ratings† Ambient temperature under bias............................................................................................................. -55°C to +125°C Storage temperature ............................................................................................................................... -65°C to +150°C Voltage on any pin with respect to Vss (except VDD and RST)....................................................... -0.3V to (VDD + 0.6V) VDD................................................................................................................................................................... 0V to 7.0V Voltage on RST with respect to Vss.................................................................................................................. 0V to 14V Total power dissipation (Note 1) .............................................................................................................................. 1.0 W Maximum source current out of VSS pin ............................................................................................................... 300 mA Maximum sink current into VDD pin ....................................................................................................................... 250 mA Input clamp current, Iik (Vi < 0 or Vi > VDD) .......................................................................................................... ±20 mA Output clamp current, Iok (VO < 0 or VO > VDD).................................................................................................... ±20 mA Maximum current sunk by any I/O pin..................................................................................................................... 25 mA Maximum current sourced by any input pin ............................................................................................................ 25 mA Maximum current sunk by GPIO port.................................................................................................................... 200 mA Maximum current sourced by GPIO port ..............................................................................................................200 mA Soldering temperature of leads (10 seconds) ....................................................................................................... +300°C ESD protection on all pins .................................................................................................................................................. ≥ 3.5 kV Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL) FIGURE 9-1: MCP2505X VOLTAGE-FREQUENCY GRAPH † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Frequency 6.0V 5.5V 4.5V 4.0V 2.0V 25 MHz 5.0V 3.5V 3.0V 2.7V Fmax = (9.44 MHz/V) (VDDAPPMIN - 2.7V) + 8 MHz Note: VDDAPPMIN is the minimum voltage of the MCP2505X device in the application. 8MHz 4.5V MCP2505X Characterized and not 100% tested. |
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