TPS72012DRVR datasheet(13/25 Pages) TI

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THERMAL INFORMATION

POWER DISSIPATION

PACKAGE MOUNTING

N TES:

1,362

1,302

1.All lineardimen

eters.

sionsareinmillim

2.This drawingissub

outnotice.

jecttochangewith

0,994

0,934

TPS720xx

www.ti.com........................................................................................................................................................ SBVS100D – JUNE 2008 – REVISED AUGUST 2009

Thermal protection disables the output when the

The ability to remove heat from the die is different for

junction temperature rises to approximately +160°C,

each

package

type,

presenting

different

allowing the device to cool. When the junction

considerations in the printed circuit board (PCB)

temperature cools to approximately +140°C, the

layout. The PCB area around the device that is free

output circuitry is again enabled. Depending on power

of other components moves the heat from the device

dissipation,

thermal

resistance,

and

ambient

to the ambient air. Performance data for JEDEC low-

temperature, the thermal protection circuit may cycle

and high-K boards are given in the Dissipation

on and off. This cycling limits the dissipation of the

Ratings table. Using heavier copper increases the

regulator, protecting it from damage as a result of

effectiveness in removing heat from the device. The

overheating.

addition of plated through-holes to heat-dissipating

layers also improves the heatsink effectiveness.

Any tendency to activate the thermal protection circuit

indicates

excessive

power

dissipation

Power dissipation depends on input voltage and load

inadequate heatsink. For reliable operation, junction

conditions. Power dissipation (PD) is equal to the

temperature should be limited to +125°C maximum.

product of the output current times the voltage drop

To estimate the margin of safety in a complete design

across the output pass element (VIN to VOUT), as

(including

heatsink),

increase

the

ambient

shown in Equation 2:

temperature until the thermal protection is triggered;

PD = (VIN – VOUT) × IOUT

(2)

use worst-case loads and signal conditions. For good

reliability, thermal protection should trigger at least

+35°C

above

the

maximum

expected

ambient

condition

the

particular

application.

This

Solder

pad

footprint

recommendations

for

the

configuration

produces

worst-case

junction

TPS720xx are available from the Texas Instruments

temperature of +125°C at the highest expected

web site at www.ti.com.

ambient temperature and worst-case load.

The internal protection circuitry of the TPS720xx has

been designed to protect against overload conditions.

It was not intended to replace proper heatsinking.

Continuously running the TPS720xx into thermal

shutdown degrades device reliability.

Figure 28. YZU Wafer Chip-Scale Package Dimensions (in mm)

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