ADMP401

Data Sheet

Rev. E | Page 6 of 12

PRINTED CIRCUIT BOARD (PCB) LAND PATTERN LAYOUT

The recommended PCB land pattern for the ADMP401 should

have a 1:1 ratio to the solder pads on the microphone package,

as shown in Figure 4. Take care to avoid applying solder paste to

the sound hole in the PCB.

A suggested solder paste stencil pattern layout is shown in

Figure 5. The diameter of the sound hole in the PCB should be

larger than the diameter of the sound port of the microphone.

A minimum diameter of 0.5 mm is recommended.

2.62

ø1.10

ø1.68

ø0.70 (2×)

ø0.90 (3×)

2.40

1.20

2.54

0.79

1.27

Figure 4. PCB Land Pattern Layout (Dimensions Shown in mm)

1.27mm

1.2mm

2.54mm

2.62mm

3.41mm

2.4mm

0.85mm DIA. (3×)

1.8mm/1.3mm DIA. 0.2032 CUT WIDTH (4×)

0.649mm DIA. (2×)

Figure 5. Suggested Solder Paste Stencil Pattern Layout