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STPS2L30 Scheda tecnica(PDF) 6 Page - STMicroelectronics |
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STPS2L30 Scheda tecnica(HTML) 6 Page - STMicroelectronics |
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6 / 10 page ![]() Package Information STPS2L30 6/10 2 Package Information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 19. SMA footprint (dimensions in mm) Table 5. SMA dimensions Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 E C L E1 D A1 A2 b 2.63 5.43 1.4 1.64 1.4 |
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