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LR2010-R10FW Scheda tecnica(PDF) 1 Page - Bi technologies |
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LR2010-R10FW Scheda tecnica(HTML) 1 Page - Bi technologies |
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1 / 2 page ![]() Low Value Flat Chip Resistor LRC/LRF Series www.bitechnologies.com www.irctt.com www.welwyn-tt.com General Note TT electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT electronics’ own data and is considered accurate at time of going to print. © TT electronics plc 03.13 · Standard 2512, 2010 and 1206 sizes · Resistance values down to 0.003 ohms · Leach resistant solder-plated copper wrap-around termination · AEC-Q200 Qualified H W D L Protective Overcoat Resistive Element Copper Termination Solder Plating Nickel Barrier Layer Alumina Substrate Copper Wraparound Termination 2 1 5 2 / 0 1 0 2 / 6 0 2 1 R L Low Value Flat Chip Resistor LRC/LRF Series Standard 2512, 2010 and 1206 sizes Resistance values down to 0.003 ohms Leach resistant solder-plated copper wrap-around termination Low inductance - less than 0.2nH AEC-Q200 Qualified General Note Welwyn Components reserves the right to make changes in product specification without notice or liability. All information is subject to Welwyn’s own data and is considered accurate at time of going to print. © Welwyn Components Limited · Bedlington, Northumberland NE22 7AA, UK Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com Electrical Data Physical Data 04.10 A subsidiary of TT electronics plc Welwyn Components 23 LR1206 LR2010 LR2512 * 0 . 2 / 5 . 1 0 . 1 5 . 0 s t t a w C ° 0 7 t a g n it a r r e w o P R 1 o t 3 0 0 R 0 R 1 o t 3 0 0 R 0 R 1 o t 0 1 0 R 0 s m h o e g n a r e c n a t s i s e R 0 0 2 0 0 2 0 0 2 s tl o v e g a tl o v g n i d n a t s h ti w c ir t c e l e i D ) s m h o 0 5 0 . 0 w o l e b e u l a v r o f y r o t c a f t c a t n o C ( 0 0 1 ± C ° / m p p R C T % e c n a r e l o t e c n a t s i s e R ≤R005 5%, >R005 1, 2, 5% 0 9 0 8 0 4 C ° r e w o p d e t a r t a e s ir e r u t a r e p m e T Pad and trace area for max power rating @ 70°C mm2 30 30 100 *2 Watts with total solder pad and trace size of 300 mm 2 Dimensions (mm) 1 D D ) x a m ( H W L e z i S LR1206 3.20±0.305 1.63±0.203 0.8 0.48±0.25 0.48±0.25 LR2010 5.23±0.38 2.64±0.25 0.8 0.48±0.25 0.48±0.25 LR2512 6.50±0.38 3.25±0.25 0.8 0.48±0.25 0.48±0.25 LRC-LRF_E.qxd 12/23/04 10:07 AM Page 1 H W D L Protective Overcoat Resistive Element Copper Termination Solder Plating Nickel Barrier Layer Alumina Substrate Copper Wraparound Termination 2152 / 0102 / 6021 R L Low Value Flat Chip Resistor LRC/LRF Series Standard 2512, 2010 and 1206 sizes Resistance values down to 0.003 ohms Leach resistant solder-plated copper wrap-around termination Low inductance - less than 0.2nH AEC-Q200 Qualified General Note Welwyn Components reserves the right to make changes in product specification without notice or liability. All information is subject to Welwyn’s own data and is considered accurate at time of going to print. © Welwyn Components Limited · Bedlington, Northumberland NE22 7AA, UK Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com Electrical Data Physical Data 04.10 A subsidiary of TT electronics plc Welwyn Components 23 LR1206 LR2010 LR2512 * 0.2/5.1 0.1 5.0 s t t aw C ° 0 7 ta g n itar re w o P R1 o t 300R0 R1 o t 300R0 R1 o t 010R0 s m ho eg na r e c na t s i s eR 002 002 002 s tl ov e g a tl o v g n i d n a ts h ti w c ir t c elei D ) s m ho 050 . 0 w o l e b e u l a v r o f y r o t c a f t c a t no C ( 001 ± C ° / mp p RC T % e c na r e l o t e c na t s i s eR ≤R005 5%, >R005 1, 2, 5% 09 08 04 C° re w o p d etar ta e s ir e r u tare p m e T Pad and trace area for max power rating @ 70°C mm2 30 30 100 *2 Watts with total solder pad and trace size of 300 mm 2 Dimensions (mm) 1D D ) x am ( H W L ez i S LR1206 3.20±0.305 1.63±0.203 0.8 0.48±0.25 0.48±0.25 LR2010 5.23±0.38 2.64±0.25 0.8 0.48±0.25 0.48±0.25 LR2512 6.50±0.38 3.25±0.25 0.8 0.48±0.25 0.48±0.25 LRC-LRF_E.qxd 12/23/04 10:07 AM Page 1 |
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