MP1492DS datasheet(2/18 Pages) MPS

2 / 18 page

MP1492 – 2A, 4.2V-16V INPUT, FAST TRANSIENT SYNCHRONOUS STEP-DOWN CONVERTER

MP1492 Rev. 1.1

www.MonolithicPower.com

3/13/2012

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

OCP Protection

Package

Top Marking

Free Air Temperature (TA)

MP1492DS*

Latch-off Mode

MP1492

MP1492DS-A**

Hiccup Mode

SOIC8

MP1492-A

-40

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP1492DS–Z).

For RoHS Compliant Packaging, add suffix –LF (e.g. MP1492DS–LF–Z)

** For Tape & Reel, add suffix –Z (e.g. MP1492DS-A–Z).

For RoHS Compliant Packaging, add suffix –LF (e.g. MP1492DS-A–LF–Z)

PACKAGE REFERENCE

SOIC8

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VIN ....................................... 19V

VSW........................................-0.3V to VIN + 0.3V

VBST ...................................................... VSW + 6V

All Other Pins..................................-0.3V to +6V

Continuous Power Dissipation (TA = +25°C)

(2)

SOIC8 ..................................................... 1.39W

Junction Temperature ..............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature............... -65

°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ...........................4.2V to 16V

Output Voltage VOUT.....................0.805V to 13V

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

SOIC8..................................... 90 ...... 45...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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