MP2012DQ datasheet(2/10 Pages) MPS

2 / 10 page

MP2012 – 1.5A SYNCHRONOUS STEP-DOWN CONVERTER

MP2012 Rev. 1.01

www.MonolithicPower.com

9/22/2011

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Free Air Temperature (TA)

MP2012DQ

QFN6(3x3mm)

–40

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP2012DQ–Z).

For RoHS compliant packaging, add suffix –LF (e.g. MP2012DQ–LF–Z)

PACKAGE REFERENCE

TOP VIEW

Exposed Pad

Connected to GND

GND

VIN

PVIN

ABSOLUTE MAXIMUM RATINGS (1)

PVIN, VIN to GND......................–0.3V to + 6.5V

SW to GND .......................... –0.3V to VIN + 0.3V

EN, FB to GND ...........................–0.3V to +6.5V

Operating Temperature............. –40°C to +85°C

Continuous Power Dissipation (TA = +25°C)

(2)

………………………………………………....2.5W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature ............. –65°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN .............................2.7V to 6V

Operating Junct. Temp (TJ)..... –40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

QFN6 (3x3mm) .......................50 ...... 12 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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