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MP2480 Scheda tecnica(PDF) 2 Page - Monolithic Power Systems |
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MP2480 Scheda tecnica(HTML) 2 Page - Monolithic Power Systems |
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2 / 12 page ![]() MP2480 – 36V INPUT, 3A HIGH POWER LED DRIVER MP2480 Rev. 1.01 www.MonolithicPower.com 2 1/25/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2013 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking Free Air Temperature (TA) MP2480DN* SOIC8-EP MP2480 -40 °C to +85°C * For Tape & Reel, add suffix –Z (e.g. MP2480DN–Z); For RoHS compliant packaging, add suffix –LF (e.g. MP2480DN–LF–Z) PACKAGE REFERENCE SW DIM EN GND BST VIN NC FB 1 2 3 4 8 7 6 5 TOP VIEW EXPOSED PAD ON BOTTOM CONNECT TO GND SOIC8-EP ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage (VIN)......................-0.3V to +40V Switch Voltage (VSW).......... -0.5V to (VIN + 0.5V) BST to SW ......................................-0.3V to +6V All Other Pins..................................-0.3V to +6V Junction Temperature...............................150°C Continuous Power Dissipation (TA = 25°C) (2) SOIC8-EP ................................................. 2.5W Lead Temperature ....................................260°C Storage Temperature............... -65°C to +150°C Recommended Operating Conditions (3) Supply Voltage VIN ..............................5V to 36V EN and DIM Voltages ...........................0V to 5V Maximum Junction Temp. (TJ) ..................125°C Thermal Resistance (4) θJA θJC SOIC8-EP ...............................50 ...... 10 ... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)- TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7 4-layer board. |
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