MP2488DN datasheet(2/14 Pages) MPS

2 / 14 page

MP2488 – 2A, 200kHz, 55V HIGH-POWER LEDS DRIVER

MP2488 Rev. 1.0

www.MonolithicPower.com

6/20/2011

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

Free Air Temperature (TA)

MP2488DQ*

QFN10(3x3mm)

–40

C to +85C

MP2488DN**

SOIC8E

MP2488DN

–40

C to +85C

*For Tape & Reel, add suffix –Z (eg. MP2488DQ–Z);

For RoHS compliant packaging, add suffix –LF (eg. MP2488DQ–LF–Z)

For Tape & Reel, add suffix –Z (eg. MP2488 DN–Z);

For RoHS compliant packaging, add suffix –LF (eg. MP2488 DN–LF–Z)

PACKAGE REFERENCE

TOP VIEW

COMP

BST

VIN

FREQ

GND

EXPOSED PAD

QFN10(3x3mm)

COMP

BST

VIN

FREQ

GND

TOP VIEW

EXPOSED PAD

SOIC8E

ABSOLUTE MAXIMUM RATINGS

(1)

Supply Voltage (VIN).....................–0.3V to +60V

Switch Voltage (VSW)............ –0.5V to VIN + 0.5V

BST to SW .....................................–0.3V to +5V

All Other Pins.................................–0.3V to +5V

Junction Temperature...............................150

C

Lead Temperature ....................................260

C

Storage Temperature.............. –65°C to +150

C

Continuous

Power

Dissipation

(TA=+25C )

(2)

QFN10(3x3mm) ......................................... 2.5W

SOIC8 (Exposed Pad) ............................... 2.5W

Recommended Operating Conditions

(3)

Supply Voltage VIN ...........................4.5V to 55V

Maximum Junction Temp. (TJ) ............... +125C

Thermal Resistance

(4)

θJA

θJC

QFN10(3x3mm)...................... 50 ...... 12...

C/W

SOIC8 (Exposed Pad) ............ 50 ...... 10...

C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/ θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7 4-layer board.

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