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MP4700GS Scheda tecnica(PDF) 2 Page - Monolithic Power Systems |
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MP4700GS Scheda tecnica(HTML) 2 Page - Monolithic Power Systems |
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2 / 19 page ![]() MP4700 – HIGH-BRIGHTNESS BCM, LOW SIDE BUCK WLED DRIVE WLED DRIVER MP4700 Rev. 1.0 www.MonolithicPower.com 2 10/29/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2012 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking MP4700GS SOIC8 MP4700 *For Tape & Reel, add suffix –Z (eg. MP4700GS-Z) PACKAGE REFERENCE ABSOLUTE MAXIMUM RATINGS (1) VIN..................................................-0.3V to 20V VCC, DRV.......................................-0.3V to 11V PWM, INUV, CS ............................-0.3V to 6.5V Continuous Power Dissipation....... (TA=25°C) (2) SOIC8………………………………………..1.3W Junction Temperature...............................150°C Lead Temperature ....................................260°C Storage Temperature............... -55°C to +150°C Recommended Operating Conditions (3) VIN ......................................................8V to 18V VCC, DRV………………………. -0.3V to 10.5V Operating Junct. Temp(TJ)...... –40°C to +125°C Thermal Resistance (4) θJA θJC SOIC8 .....................................96 ...... 45 ... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)- TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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