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MP6231 Scheda tecnica(PDF) 2 Page - Monolithic Power Systems

Il numero della parte MP6231
Spiegazioni elettronici  3.3V/5V, Dual-Channel 500mA Current-Limited Power Distribution Switches
PDF  12 Pages
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Produttore elettronici  MPS [Monolithic Power Systems]
Homepage  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP6231 Scheda tecnica(HTML) 2 Page - Monolithic Power Systems

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MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
MP6231/MP6232 Rev. 1.2
www.MonolithicPower.com
2
3/31/2010
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number
Enable
Switch
Maximum
Continuous
Load Current
Typical Short-
Circuit Current
@ TA=25C
Package
Top
Marking
Free Air
Temperature
(TA)
MP6231DN*
SOIC8E
MP6231DN
MP6231DH
MSOP8E
6231D
MP6231DS
Active
High
SOIC8
MP6232DN
SOIC8E
MP6232DN
MP6232DH
MSOP8E
6232D
MP6232DS
Active
Low
Dual
0.5A
750mA
SOIC8
-40
°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP6231DN–Z).
For RoHS compliant packaging, add suffix –LF (e.g. MP6231DN–LF–Z)
PACKAGE REFERENCE
1
2
3
4
8
7
6
5
TOP VIEW
GND
IN
EN1*
EN2*
FLAG1
OUT1
OUT2
FLAG2
EXPOSED PAD
ON BACKSIDE
CONNECT TO GND
MSOP8E
GND
IN
EN1*
EN2*
FLAG1
OUT1
OUT2
FLAG2
1
2
3
4
8
7
6
5
TOP VIEW
EXPOSED PAD
ON BACKSIDE
SOIC8E
GND
IN
EN1*
EN2*
FLAG1
OUT1
OUT2
FLAG2
1
2
3
4
8
7
6
5
TOP VIEW
SOIC8
MP6231/MP6232Dual-Channel
(* EN is active high for MP6231)
ABSOLUTE MAXIMUM RATINGS
(1)
IN .................................................-0.3V to +6.0V
EN, FLAG, OUT to GND ..............-0.3V to +6.0V
Continuous Power Dissipation (TA = +25°C)
(2)
SOIC8E...................................................... 2.5W
MSOP8E.................................................. 2.27W
SOIC8 ........................................................ 1.4W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... -65°C to +150°C
Operating Junct. Temp. ........... -40°C to +125°C
Thermal Resistance
(3)
θJA
θJC
SOIC8E .................................. 50 ...... 10...
°C/W
MSOP8E................................. 55 ...... 12...
°C/W
SOIC8..................................... 90 ...... 42...
°C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) Measured on JESD51-7, 4-layer PCB.



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