MP6900DS datasheet(2/12 Pages) MPS

2 / 12 page

MP6900- FAST TURN-OFF INTELLIGENT CONTROLLER

MP6900 Rev. 1.12

www.MonolithicPower.com

9/19/2012 MPS Proprietary Information. Patent Protected. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

MP6900DJ*

TSOT23-5

MP6900DS**

SOIC-8

MP6900DS

MP6900DQ***

QFN6 (3x3mm)

* For Tape & Reel, add suffix –Z (e.g. MP6900DJ–Z).

For RoHS Compliant Packaging, add suffix –LF (e.g. MP6900DJ–LF–Z)

** For Tape & Reel, add suffix –Z (e.g. MP6900DS–Z).

For RoHS Compliant Packaging, add suffix –LF (e.g. MP6900DS–LF–Z)

*** For Tape & Reel, add suffix –Z (e.g. MP6900DQ–Z).

For RoHS Compliant Packaging, add suffix –LF (e.g. MP6900DQ–LF–Z)

PACKAGE REFERENCE

TOP VIEW

VSS

VDD

PGND

VDD

VSS

TOP VIEW

TSOT23-5

SOIC-8

QFN6 (3x3mm)

ABSOLUTE MAXIMUM RATINGS

(1)

VDD to Vss ......................................-0.3V to +27V

PGND to VSs ................................-0.3V to +0.3V

VG to VSS ......................................... -0.3V to VCC

VD to VSS .....................................-0.7V to +180V

EN to VSS .....................................-0.3V to +6.5V

Maximum Operating Frequency............. 400kHz

Continuous Power Dissipation (TA = +25°C)

(2)

SOIC8 ...................................................... 1.39W

TSOT23-5 ................................................ 0.57W

QFN6 (3x3mm) .......................................... 2.5W

Junction Temperature...............................150

°C

Lead Temperature (Solder).......................260

°C

Storage Temperature .............. -55°C to +150

°C

Recommended Operation Conditions

(3)

VDD to Vss ............................................8V to 24V

Operating Junction Temp. (TJ).... -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

SOIC8..................................... 90 ...... 45...

°C/W

TSOT23-5.............................. 220 .... 110..

°C/W

QFN6 (3x3mm)....................... 50 ...... 12...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature. TJ(MAX) the junction-to-

ambient thermal resistance θJA and the ambient temperature

TA. The maximum allowable power dissipation at any ambient

temperature is calculated using: PD(MAX)=(TJ(MAX)-TA)/ θJA.

Exceeding the maximum allowable power dissipation will

cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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