THS3001

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGED DEVICE

TRANSPORT MEDIA,

EVALUATION

SOIC

MSOP

MSOP

QUANTITY

MODULE

(D)

(DGN)

SYMBOL

THS3001CD

THS3001CDGN

Rails, 75

THS3001EVM

ADP

THS3001CDR

THS3001CDGNR

Tape and Reel, 2500

--

0°C to 70°C

THS3001HVCDGN

Rails, 75

--

BNK

THS3001HVCDGNR

Tape and Reel, 2500

--

THS3001ID

THS3001IDGN

Rails, 75

--

ADQ

THS3001IDR

THS3001IDGNR

Tape and Reel, 2500

--

-40°C to 85°C

THS3001HVIDGN

Rails, 75

--

BNJ

THS3001HVIDGNR

Tape and Reel, 2500

--

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

THS3001

THS3001HV

UNITS

33

37

V

Input voltage

V

Output current

175

175

mA

Differential input voltage

±6

±6

V

Continuous total power dissipation

See Dissipation Rating Table

150

150

°C

125

125

°C

THS3001C,

0 to 70

0 to 70

°C

THS3001HVC

Operating free-air temperature

THS3001I,

–40 to 85

–40 to 85

°C

THS3001HVI

Storage temperature

–65 to 125

–65 to 125

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

The absolute maximum temperature under any condition is limited by the constraints of the silicon process.

(3)

The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may

result in reduced reliability and/or lifetime of the device.

DISSIPATION RATING TABLE

(1)

PACKAGE

(°C/W)

(°C/W)

D (8)

38.3

97.5

1.02 W

410 mW

DGN (8)

4.7

58.4

1.71 W

685 mW

(1)

This data was taken using the JEDEC standard High-K test PCB.

(2)

Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase.

Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long

term reliability.

2

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