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STM8S103F3P6 Scheda tecnica(PDF) 93 Page - STMicroelectronics |
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STM8S103F3P6 Scheda tecnica(HTML) 93 Page - STMicroelectronics |
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93 / 113 page ![]() 32-lead UFQFPN package mechanical data 11.2 Figure 46: 32-lead, ultra thin, fine pitch quad flat no-lead package (5 x 5) AOB8_ME 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. 4. Dimensions are in millimeters. Table 53: 32-lead, ultra thin, fine pitch quad flat no-lead package mechanical data inches (1) mm Dim. Max Typ Min Max Typ Min 0.0236 0.0217 0.0197 0.600 0.550 0.500 A 0.0020 0.0008 0.050 0.020 0 A1 0.0079 0.200 A3 93/113 DocID15441 Rev 6 Package information STM8S103K3 STM8S103F3 STM8S103F2 |
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