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STPS2L40AF Scheda tecnica(PDF) 5 Page - STMicroelectronics

Il numero della parte STPS2L40AF
Spiegazioni elettronici  Low drop power Schottky rectifier
PDF  10 Pages
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Produttore elettronici  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STPS2L40AF Scheda tecnica(HTML) 5 Page - STMicroelectronics

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STPS2L40
Characteristics
5/10
Figure 13.
Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 14.
Junction capacitance versus
reverse voltage applied (typical
values)
Figure 15.
Forward voltage drop versus
forward current (high level)
Figure 16.
Forward voltage drop versus
forward current (low level)
I (mA)
R
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0
5
10
15
20
25
30
35
40
T
j=125°C
T
j=25°C
V (V)
R
10
100
1000
1
10
100
C(pF)
V (V)
R
F=1MHz
V
=30mV
T =25°C
OSC
RMS
j
0.1
1.0
10.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
I
(A)
FM
V
(V)
FM
T =25°C
(maximum values)
j
T =125°C
(maxmimum values)
j
T =125°C
(typical values)
j
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
I
(A)
FM
V
(V)
FM
T =25°C
(maximum values)
j
T =125°C
(maxmimum values)
j
T =125°C
(typical values)
j
Figure 17.
Thermal resistance junction to
ambient versus copper surface
under each lead, SMB, SMBflat
(epoxy printed board FR4, copper
thickness = 35 µm)
Figure 18.
Thermal resistance junction to
ambient versus copper surface
under each lead, SMAflat (epoxy
printed board FR4, copper
thickness = 35 µm)
0
10
20
30
40
50
60
70
80
90
100
110
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
S
(cm²)
CU
SMB
R
(°C/W)
th(j-a)
SMBflat
0
20
40
60
80
100
120
140
160
180
200
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
SMAflat
S
(cm²)
CU
R
(°C/W)
th(j-a)



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