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ASM3106C Scheda tecnica(PDF) 6 Page - Aplus Intergrated Circuits |
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ASM3106C Scheda tecnica(HTML) 6 Page - Aplus Intergrated Circuits |
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6 / 7 page ![]() Rev 1.0 5 1.4 Bonding Diagram ASM3106C/4106C Pad Location Chip Size: X=1550+100 (um), Y=2170+100 (um) PAD # PAD Name X Y PAD # PAD Name X Y 1 RA_PAD[3] -664.92 -675.72 7 TEST_PAD 105.44 -1000.4 2 RA_PAD[2] -664.92 -803.84 8 ACOUT 303.96 -1000.4 3 RA_PAD[1] -662.64 -1000.4 9 VDD 683.04 -1000.4 4 RA_PAD[0] -468.24 -1000.4 10 RB_PAD[0] 664.92 -799.4 5 AOSC -281.04 -1000.4 11 RB_PAD[1] 664.92 -681 6 GND -111.72 -1000.4 ASM3106C/4106C CHIP SIZE: X= 1550+100(um) , Y= 2170+100(um) 128K x 10 bit ROM 6 7 8 9 5 4 1 2 3 10 11 ASM3106C/4106C |
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