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AS2534RF Scheda tecnica(PDF) 25 Page - ams AG

Il numero della parte AS2534RF
Spiegazioni elettronici  Multi-Standard CMOS Telephone IC for Basic Telephones
PDF  26 Pages
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Produttore elettronici  AMSCO [ams AG]
Homepage  http://www.ams.com
Logo AMSCO - ams AG

AS2534RF Scheda tecnica(HTML) 25 Page - ams AG

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Data She et AS25 33-36
austriamicrosystems
Revision 8.10
Page 24 of 25
Packaging
The device is available in the packages outlined below (not
to scale). For exact mechanical package dimensions
please see austriamicrosystemsAG packaging information.
28-pin plastic SOIC (suffix T)
Max. Body Length
18.1mm / 713mil
Max. Body Width
7.6mm / 300mil
Pitch
1.27mm / 50mil
Pin Configuration
28 Pin SOIC (suffix T)
Ordering Information
Device
Order Number
Package
Features
AS2533 T
AS2533U-ZSO-U
28 pin SOIC in tubes
LNR, 4 direct/10 indirect memories
AS2533 F
pls see bottom rows
Dice on foil, sawn
LNR, 4 direct/10 indirect memories
AS2533 W
pls see bottom rows
Dice on wafer
LNR, 4 direct/10 indirect memories
AS2534B T
AS2534U-ZSO-U
28 pin SOIC in tubes
LNR only, no direct/indirect memories (2)
AS2534B F
pls see bottom rows
Dice on Foil, sawn
LNR only, no direct/indirect memories
AS2534B W
pls see bottom rows
Dice on Wafer
LNR only, no direct/indirect memories
AS2534R T
AS2534R-ZSO-U
28 pin SOIC in tubes
LNR only, no direct/indirect memories, ringer fixed (2)
AS2534R F
pls see bottom rows
Dice on Foil, sawn
LNR only, no direct/indirect memories, ringer fixed
AS2534R W
pls see bottom rows
Dice on Wafer
LNR only, no direct/indirect memories, ringer fixed
AS2535 T
AS2535U-ZSO-U
28 pin SOIC
LNR, 12 direct memories
AS2535 F
pls see bottom rows
Dice on Foil, sawn
LNR, 12 direct
AS2535 W
pls see bottom rows
Dice on Wafer
LNR, 12 direct
AS2536 T
AS2535U-ZSO-U
28 pin SOIC
LNR, 4 direct/10 indirect memories
AS2536 F
pls see bottom rows
Dice on Foil, sawn
LNR, 4 direct/10 indirect memories
AS2536 W
pls see bottom rows
Dice on Wafer
LNR, 4 direct/10 indirect memories
AS253x F
AS253xU-ZSW-F
Dice on Foil, sawn
All versions (1)
AS253x W
AS253xU-ZSW
Dice on Wafer
All versions (1)
AS253xR F
AS253xR-ZSW-F
Dice on Foil, sawn
All versions, ringer fixed (1)
AS253xR W
AS253xR-ZSW
Dice on Wafer
All versions, ringer fixed (1)
Please Note:
(1) For wafer delivery or dice-on-foil delivery, the versions can be selected by bond options.
(2) For deliveries as packaged devices (SOIC28), LNR only is tested, direct and indirect memories are not tested!



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