RT2010 datasheet(7/10 Pages) YAGEO

7 / 10 page

Chip Resistor Surface Mount

www.yageo.com

Oct 21, 2009 V.4

Product specification

SERIES

0402 to 2512 (RoHS Compliant)

TESTS AND REQUIREMENTS

TEST

TEST METHOD

PROCEDURE

REQUIREMENTS

At +25/–55 °C and +25/+125 °C

Temperature

Coefficient of

Resistance

(T.C.R.)

IEC 60115-1 4.8

Formula:

T.C.R= ------------------------- ×106 (ppm/°C)

Where

t1=+25 °C or specified room temperature

t2=–55 °C or +125 °C test temperature

R1=resistance at reference temperature in ohms

R2=resistance at test temperature in ohms

Refer to table 2

Life/Endurance

IEC 60115-1 4.25.1

At 70±5 °C for 1,000 hours, RCWV applied for

1.5 hours on, 0.5 hour off, still air required

±(0.5%+0.05 Ω)

High

Temperature

Exposure/

Endurance at

Upper Category

Temperature

IEC 60068-2-2

1,000 hours at 155±5 °C, unpowered

±(0.5%+0.05 Ω)

Moisture

Resistance

MIL-STD-202G Method-106G

Each temperature / humidity cycle is defined at 8

hours, 3 cycles / 24 hours for 10d. with 25 °C /

65 °C 95% R.H, without steps 7a & 7b,

unpowered

Parts mounted on test-boards, without

condensation on parts

Measurement at 24±2 hours after

test conclusion

±(0.5%+0.05 Ω)

Thermal Shock

MIL-STD-202G Method-107G

-55/+125 °C

Number of cycles required is 300. Devices

unmounted

Maximum transfer time is 20 seconds. Dwell time

is 15 minutes. Air – Air

±(0.5%+0.05 Ω) for 10 KΩ to

10 MΩ

±(0.5%+0.05 Ω) for others

Humidity

(steady state)

IEC 60115-1 4.37

Steady state for 1000 hours at 40 °C / 95% R.H.

RCWV applied for 1.5 hours on and

0.5 hour off

±(0.5%+0.05 Ω)

Table 4 Test condition, procedure and requirements

R2–R1

R1(t2–t1)

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